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Power chips are attached to exterior circuits through packaging, and their performance depends upon the support of the packaging. In high-power situations, power chips are usually packaged as power components. Chip affiliation describes the electric link on the top surface of the chip, which is typically light weight aluminum bonding cable in traditional components. ^
Conventional power component plan cross-section

At present, commercial silicon carbide power modules still primarily use the product packaging modern technology of this wire-bonded traditional silicon IGBT module. They encounter troubles such as big high-frequency parasitical specifications, insufficient warm dissipation capability, low-temperature resistance, and not enough insulation stamina, which limit making use of silicon carbide semiconductors. The screen of exceptional efficiency. In order to solve these problems and fully exploit the substantial prospective benefits of silicon carbide chips, several new packaging modern technologies and services for silicon carbide power components have actually emerged recently.

Silicon carbide power component bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding products have actually developed from gold cable bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually developed from gold cords to copper wires, and the driving force is cost reduction; high-power gadgets have created from aluminum cables (strips) to Cu Clips, and the driving pressure is to boost item efficiency. The greater the power, the greater the requirements.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that uses a strong copper bridge soldered to solder to connect chips and pins. Compared to standard bonding product packaging approaches, Cu Clip innovation has the adhering to benefits:

1. The link between the chip and the pins is made of copper sheets, which, to a certain level, changes the typical cord bonding technique in between the chip and the pins. As a result, a special package resistance worth, higher existing circulation, and much better thermal conductivity can be obtained.

2. The lead pin welding location does not need to be silver-plated, which can completely conserve the price of silver plating and bad silver plating.

3. The item appearance is completely constant with normal products and is mostly utilized in web servers, mobile computer systems, batteries/drives, graphics cards, motors, power materials, and various other areas.

Cu Clip has two bonding methods.

All copper sheet bonding approach

Both the Gate pad and the Source pad are clip-based. This bonding approach is more pricey and complex, yet it can attain much better Rdson and better thermal results.

( copper strip)

Copper sheet plus cord bonding technique

The source pad uses a Clip technique, and eviction makes use of a Wire method. This bonding approach is somewhat less costly than the all-copper bonding technique, conserving wafer location (appropriate to extremely tiny gate locations). The procedure is simpler than the all-copper bonding technique and can obtain better Rdson and much better thermal effect.

Distributor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding copper price per gram, please feel free to contact us and send an inquiry.

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